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LED Aluminum Profile series (street lamp aluminum plate), street lamp aluminum board is a kind of application in the LED street lamp, solar street light on a cooling lower temperature heat release.
It is a kind of street lamp base site use, replace the old PCB circuit boards, on aluminum plate was full of line, usually the lamps of the aluminum plate 12 w, 14 w, 24 w and w, 36 w, fifty w, 72 w, 80 w, 150 w, etc., the size of the power generally depends on the street lamp head size, and its own heat dissipation.

Street lamp aluminum plate
Street lamp aluminum plate in China is just starting out, only some of the application of large and medium-sized cities in the street lamp is used, some other the edge of the area in the future 3 to 5 annual meeting slowly change, the country has been advocating environmental protection, energy saving, low carbon lighting line, street lamp aluminum plate service life is in commonly 100000 hours, high thermal conductivity, low thermal resistance.

Street lamp, referring to provide road and traffic lighting lamps and lanterns. Installation site in road one or both sides. It consists of lamps and lanterns, electrical appliances, light source, lighting, lamp arm, flange, basic embedded parts form a whole. Aluminium LED Profile
High power LED street light and conventional high-pressure sodium lamp street lamp is different, the high power LED street lamp light source adopts low voltage dc power supply, the GaN base power type blue LED and yellow phosphor powder synthesis efficient white light diode, with high efficiency, safety, energy saving, environmental protection, long service life, fast response, color rendering index higher unique advantages, can be widely used in urban road lighting.
Light emitting diode (LED) is based on semiconductor PN junction formation by weak electricity can luminous efficiency solid-state light source, in a positive bias voltage and injection current flow into the hole and P, the electronic injection N in diffusion to a source area after the radiative recombination and emit a photon, energy directly into light energy. Compared with the traditional street lamp lighting, LED street lamp has the following advantages: 1. The function and characteristics of the revolutionary with light design - The world's first street lamp special optical system (rectangular spot projection lens). The reasonable control of the distribution of light to spot has a rectangular shape, to ensure that the ideal surface brightness and uniformity, and at the same time, eliminate the common high power LED street light glare and high power LED street lamp light energy utilization to acme, no light pollution;
2. Unique lens and chimney integration design. Lens array at the same time bear collector and protective effect, avoid the repetition of light waste and reduce the light loss, but also reduce the high power LED street light weight, simple structure, and make our products more frivolous,;
3. The radiator and lamp shell integration design. Fully guarantee the high power LED street light cooling requirements and service life, fundamentally meet the high power LED street light lamps and lanterns structure and shape of any design, extremely high power LED street light bright characteristics; Domestic manufacturer is design of acicular radiator cooling efficiency than traditional plate radiator is greatly improved, can make the LED junction temperature 15 ℃ lower than normal radiator above in the world are first.
4. A unique innovation of the modular design. Can be arbitrary combination into different power and brightness demands the product. Each module is an independent source and interchangeable, partial failure does not affect the normal work of lamps and lanterns, convenient disassembly and maintenance, save maintenance costs, make the maintenance work became very easily;
5. Look for light. High power LED street light effectively reduces wind resistance and weight, reduce the load of the lamp post, enhance the safety coefficient,;
6. Intelligent monitoring, precision constant current. Domestic manufacturers have developed one of the world's leading high pressure CCS constant current source device, can provide both constant voltage and constant current drive circuit, to make every way LED light source is double protection, delay the LED light source of aging.
LED Aluminium Profile
CCS constant current source device 7. Not bad, glare. Eliminate ordinary high power LED street lamp bad glare caused by the dazzling, visual fatigue and line of sight interference, and improve the driving safety and reduce traffic accidents, fully embodies the "science and technology humanist" of the Spirit,;
8. No light pollution. Light distribution designed for road lighting design, in addition to illuminating the road itself, on the surrounding environment has no light pollution;
9. No pressure, no dust absorption. Eliminate the common high power LED street lamp for high pressure absorbing dust lead to black chimney caused to reduce brightness,;
No high temperature aging, chimney will not be yellow. Eliminate the common high power LED street lamp for high temperature baking chimney makes its aging caused by the yellow brightness is reduced and a shortening of lifespan;
11. Wide working voltage ranges. The traditional light source such as high pressure sodium lamp working voltage fluctuation more than plus or minus 7%, life and brightness fell sharply, and high power LED street lamp BBE working voltage even fluctuation plus or minus 20%, life and brightness is still the same.
12. Start without delay. Electricity is of normal brightness, do not need to wait, eliminate the traditional LED street lamp long time start-up process;
13. No stroboscopic. Pure dc and eliminate the traditional street lamp stroboscopic cause visual fatigue;
14. Impact resistance, seismic force strong, no ultraviolet (UV) and infrared (IR) radiation. No filament and glass shell, no traditional tube cataclastic problems, no damage to human body, no radiation,
15. Color rendering index is high, good color rendering. The color of the present the more real, more bright-coloured, identification of better;
16. A variety of colours in WenKeXuan. To meet the different occasions for color temperature demand, eliminate the sodium lamp color temperature is too low and mercury lamp color temperature from the higher hypnotic emotions and depressive mood, make the observer feel more comfortable;
17. Significant energy savings. High power LED super bright light source with high efficiency power than the traditional sodium lamp. Mercury lamp power saving more than 80%;
Long life 50000 hours. LED using high reliability of the advanced packaging technology, eutectic welding, to fully guarantee the BBE high power LED street lamp of the long life, is the traditional sodium lamp, mercury lamp 5 ~ 10 times;
19. The green environmental protection. High power LED street lamp does not contain lead, mercury and other pollution elements, no pollution to the environment;
Input voltage is universal. 85-265 vacs full voltage range constant current, PWM constant current technology, high efficiency, quantity of heat low, constant current high precision;
21. No pollution to the power network. Power factor was 0.9, harmonic distortion or less 20%, EMI complies with the global index, reduces the power supply circuit of electric power loss and avoids the grid of the high frequency interference pollution,;
22. Low carb, low voltage, safe and reliable. LED junction temperature control in the ideal temperature (TJ < sixty, environment temperature Ta = 25);
23. And Solar Union, "Goddess marriage". Give full play to the high power LED street light low work and energy conservation and environmental protection advantages, according to local conditions of solar energy resources, but also will mains and solar power supply for the customer to realize the combination of the best price and high reliability;
24. High luminous efficiency. The existing conditions LED luminous efficiency were 80 lm/w, along with the LED brightness rapidly increase, luminous efficiency reached 150 lm/w, 400 w sodium lamps will be 80 instead of wild street lamp. Finally can reach 300 lm/W, energy saving effect is more outstanding.
]]> https://ameblo.jp/carlanaha/entry-11429753711.html Tue, 18 Dec 2012 17:28:53 +0900

Radiator design

Have to talk about the radiator, a concept first finds out, which is the difference between the thermal conductivity and heat dissipation? Thermal conductivity is the fastest heat from the heat source transfer to the radiator surface, and heat is the heat from Aluminum LED Profile surface sends out into the air. First of all to put not the fastest derived, and then to the most effective scattered into the air. Because no matter what method using heat, finally can only put the quantity of heat to send out into the air. And heat emission only two ways: convection and radiation.

1, convection and radiation



Q for dispersed quantity of heat. H for thermal convection coefficient, A is A radiator cooling area, train T for radiator surface and nearby air temperature difference between.



Fins of cooling is mainly by convection and radiation. The convection is the most important. This two parts depend on the total area of the fins. The area is larger, the effect of heat dispelling better. However, convection heat dissipation is not totally depends on the size of the fins are, but also related to the wind and the wind in the completely calm state, then and natural convection of the resistance. Such as if to dust and the bird's excrement accumulation, fins down the installation, so fins ends can't block, and lamps and lanterns or downward sloping or batter, can let the hot air to flow smoothly.

Thermal radiation heat dissipation formula for "Q = E S F Δ (Ta - Tb)". The formula Q represent the heat exchange ability. E is surface thermal radiation coefficient. In reality, when material for metal and the surface is bright and clean, thermal radiation coefficient is small, and the metal surface treatment (such as black) the surface thermal radiation coefficient value will improve. Plastic or non-metallic kind of thermal radiation coefficient value most is high. S is the object surface area. F is the radiation heat transfer angle and surface function relation, but here the function is much more difficult to explain. Δ (Ta - Tb) is a surface temperature of the surface of the temperature difference between with b. So the thermal radiation and heat radiation coefficient, the size of the object surface area and the temperature difference between in direct proportional relationship. Absolute blackbody radiation coefficient is 1. Thermal radiation heat dissipation can also use another formula to say: The table shows. Oxidation treatment is to improve the radiation materials are an important way. The cast iron radiator has a quite part of the heat by radiation. And plastic thermal properties and oxidation of metal almost.

In order to improve LED Profile, aluminum alloy fins radiator must carry on the black finish, but someone is to use spray black plastic paint method, this method is also make its surface black, but in fact and add a layer insulation layer, hampered its heat dissipation. The best approach is to adopt an anode black finish, the oxide layer can be very thin, not affect the heat dissipation, but radiation has a great improvement.

Anyhow, no matter by convection or radiation are long-lived and radiator is proportional to the area, so to improve the heat dissipation must increase the area of the radiator.

Fins radiator

Radiator fins shape is to increase the cooling area. To radiation and convection. The most important indicators of the radiator are its cooling area A, but different parts of the radiator of the cooling effect are different. In the root of the cooling effect is bad, and at the top of the cooling effect is good. So radiator has an effective cooling area. It is usually about 70% of the actual area. From the experience of the general, the quantity of heat of scattered 1 w power for fifty - square centimeters of effective radiator area.

And radiator materials are usually made of aluminum alloy, copper and compared the heat conduction, although only half of the copper, but it is light weight, easy processing, the price is cheap, so it is still widely used in heat sink in. A typical cooling aluminium alloy profiles as showed in figure 11 shows.

Figure 12. LED junction temperature increases with the height of the radiator and reduces

The can be seen from the graph, highly increased to forty mm later. Junction temperature reduction is a very slow.

Increase the length is also increasing area of a method. But it's not the length, and the longer, the better.

In the diagram, it is known that the length increased to a certain degree later. Junction temperature not only no longer reduces, it will rise. This is because air along the length direction of the flow caused by obstacles (mainly for vertical placed fins of so).

So for LED Aluminum Profile speaking, in addition to increase the area beyond, how to speed up the air convection is very important, especially like LED street lamp this kind of installed in outdoor street lamp is more important. Due to the outdoor wind is indefinite, in order to in various wind cases can have a very good connection, had better use pin fins radiator. But it also reduced its equivalent cooling area large percentage.

Street lamp radiator often due to the accumulation of dust and guano and make the heat dissipation effect greatly reduced, so usually adopt down installation method to avoid, but to do so and will make the air convection effect is reduced, because the hot air is flow up. Usually there is a the installation angle to improve.

The forced air cooling heat dissipation

Now almost the majority of the LED lamps and lanterns are the natural air convection to the heat. However, the convection heat transfer and air flow rate is that there is a close relationship.

In the computer CPU, never is to use a small fan of forced air cooling system to the heat. So in the LED cannot also USES fan to heat!

At present, the most high power LED lamps and lanterns is LED street light the. LED street lamp and computer the biggest difference is that it is installed in the outdoor very bad conditions. If the fan, the fan also must be able to withstand very harsh environmental conditions. Such as must be able to waterproof, moisture-proof, dust proof, able to withstand the test of high and low temperature, and so on.

Concluding remarks

At present, LED luminous efficiency is low. Thus cause and high temperature, reduce the service life. In order to reduce the junction temperature in order to improve the life we must attach great importance to the problem of heat. The thermal design must be LED chip from the beginning to the radiator, every link to give full attention to. A part of any improper design can cause serious heat dissipation problems. The past LED street lamp in long-term work in a large number of failures, more than half of which is caused by lack of thermal design, and the other is caused by power failure. So for cooling design must give full attention.
]]> https://ameblo.jp/carlanaha/entry-11429072301.html Mon, 17 Dec 2012 17:44:27 +0900
Along with the progress of science and technology, human beings in lighting field have been developing rapidly. The invention of LED lights the designer's more idea, also let lighting facilities of lower energy consumption, higher brightness, more changes. LED with small volume, low power consumption, long service life, high brightness, high quantity of heat low, environmental protection, durable etc have gained wide acceptance and favor. In just a few short years between,LED Aluminum Profile have a wide range of replacing the traditional lighting accessories, especially in the automobile, electronic appliances, medical care and other advanced industries and fields.

The rapid development of LED industry, greatly moved upstream materials industry development, and further promotes the breakthrough of high-end materials. LED lamps and lanterns use lots of plastic parts, including LED chips encapsulation component, LED optical lens, light scattering element, efficient cooling element, light reflection and light diffuse plate, etc. LED lamp is a kind of sustainable alternative lighting scheme, than fluorescent lamp and incandescent lamp energy saving 30% to 80%. Although LED Lantern Festival can and heat dissipating capacity is small, but its Aluminium LED Profile heat dissipation performance quality LED lamp life and energy-saving effect is very key. Therefore, scientific research personnel using thermal filler to polymer substrate materials for uniform filling, in order to improve its thermal performance, developed can effectively transfer heat thermal plastic.

Thermal plastic is more and more to replace the metal parts used in the thermal conductivity of LED lamps and lanterns parts, including lamp holder, cooling heat lamp cup and shell, etc. Compared to traditional metal materials, thermal conductive plastics has many advantages, summarized up have the following four: first, heat evenly, avoid hot point, reduce parts for high temperature caused by local distortion. Secondly, the weight is light, lighter than aluminum forty to 50%. Thirdly, forming convenient, no secondary processing. Fourth, high product design degrees of freedom.

Today's people to carbon emissions to keep high attention, and gradually enhance energy conservation and environmental protection consciousness, the birth of LED technology to help people realize the goal of sustainable development. The thermal plastic alternative metal, can increase the flexibility of lamps and lanterns modelling design, reduces the total weight of lamps and lanterns. In addition, the application of thermal plastic can effectively improve the lighting efficiency, save power consumption. As the government to give more attention, in special material increased technical innovation and investment dynamics. LED material especially and LED Aluminium Profile will have a very good application prospects and development space.
]]> https://ameblo.jp/carlanaha/entry-11427638656.html Sat, 15 Dec 2012 17:07:06 +0900 Led bracket is led fluorescent tube bead in packaging before the base plate, rise to protect solid crystal welding line and silica gel forming effect, guide power on the road, and affect the light, the electrical characteristics. Support structure performance has a direct influence on the LED lamp bead performance, at present a lot of light bead die lamp, the microscopic observation, light beam inside the chip and not abnormal, but connection chip alloy wire and metal base plate from cause break.
At the same time, found that cause this phenomenon's light beam is directly or indirectly exposed to the air in the light, and the air is existing in the water vapor. It can be deduced that the LED support anti moisture structure do not good, lead to moisture infiltration light bead inside, resulting in encapsulation adhesive in led replacement for fluorescent for a long time under the environment of easy and metal base plate from, make drawn off welding in the metal base plate on the alloy wire, thus forming circuit disconnection.

With the global market for led fluorescent lights of demand is more and more big, the LED light bead use of the more widely, the user to LED lamp bead performance requirements is increasingly harsh. If LED support anti moisture structure of poor design, inevitable restrictions LED lamp bead use condition, use area, uses the field and so on. As LED designers and manufacturers, must be in LED support anti moisture on the structure a breakthrough.

A, liquid flow basic knowledge

The nature of the liquid flow between gas and liquid. On one hand it like a solid, has a certain volume, is not easy to compression; on the other hand, like gas, no definite shape, have liquidity. Flow liquid because of inertia force, viscous force, etc., internal arbitrary somewhere each direction of pressure is not equal.

The liquid flow along the route will be on-way resistance and local resistance, the frictional resistance caused by the mechanical energy loss called along the path loss, overcome local resistance energy loss is called local losses. All of the flow liquid energy loss is equal to the paragraphs along the path loss and the local losses combined.

Second, prevent moisture structure design of five points

Prevent moisture structure design, as the name suggests, is to will moisture stop to the outside, or make moisture in its internal stop the flow. Support of plastic and metal base plate are two different attributes of the materials, rely on outside force make the bonding together, it is to belong to physical bonding, even if the naked eye can not see the bonding defects, but in a few times on the magnifying glass, the interface must have aperture, as shown in figure 2 shows. This determines the support will not stop moisture in vitro. That is to say must be moisture infiltration them. Therefore, support anti moisture structure design, strictly speaking, depend on its related structure design reduces infiltration within which the fluid. To make the fluid to reduce, that is to say, to make the fluid all the energy loss as far as possible in all along the path loss and the local losses on.
In TOP VIEW type of support do a experiment, will empty support dip red ink, red ink slightly flooded cover in support pin can (note: if you want to make the experimental effect more apparent, in red ink poured into alcohol, mixing ratio 1:1), 5 minutes after the termination of the experiment. The whole process microscopic observation supports cup body condition. The experimental results for: some support permeability fast, some support permeability slowly, some support permeability have mild, some support permeability is more serious. Take some finished my experiment of stents, immediately plastic and metal base plate along the gaps with pliers dividing, can find the metal base plate surface and edge have red ink mark. Therefore, the experiment can be concluded: Red Ink infiltration support cup body there are two ways, one for plastic package copper edge, secondly plastic package in copper surface, and copper of positive and negative, the latter is more serious than the former.

Analytic judgment above, can solve the problem from three aspects: first, seek plastic and metal base plate of the best fit, which relates to materials science knowledge, not in this paper discusses range; Second, control plastic injection molding process, the pursuit of the best die mild die time, this relationship to injection molding process contents, in this paper also don't do analysis; Third, is the metal base plate for processing, is also this paper said prevent moisture structure design.

Prevent moisture structure design of the key:

1. Extend as far as possible the metal base plate edge approach, and circuitous way, the better the more twists and turns.

2. As far as possible to reduce the metal base plate and the plastic area of contact, which, of course, and thermal design has conflict, both need to compromise, or sacrifice, to find the best design. Here, involves the thermal design does not make a detailed analysis.

(3) in the metal base plate surface as far as possible to make some groove and water retaining wall, increase the metal base plate surface rough degree, increase the flow of the liquid difficulty, of course, water retaining wall shape more exaggerative more, but considering the production difficulty and production cost, appropriate can.

4. Reduce metal base plate into the plastic port area, equivalent to reduce the liquid into the stent way.

5. The liquid as far as possible, leads to the support cup body. ]]> https://ameblo.jp/carlanaha/entry-11426966457.html Fri, 14 Dec 2012 17:28:57 +0900
LED down light etc lighting technology trend, the mainstream light source should be the CoB (chip on board) package for white LED module, according to the requirements of the lamps and lanterns of optical CoB packaging, at the same time also can reduce secondary optical design cost. CoB packaging LED module in the base plate installed many pieces LED Profile, using multi chip cannot only improve the brightness, also help realize LED chip science reasonable configuration, reduce the single LED chip input electrical flow to ensure high efficiency.
The LED luminous efficiency is divided into internal and external quantum efficiency, for internal quantum efficiency can reach 80% or even 90% of basic, and quantum efficiency unable to emit photons, is effective for heat absorption produce LED to high temperature and, at the same time reduce the inner quantum effect, this should be the whole LED luminous efficiency only to traditional lighting general level of reason. Therefore, to find the balance point is to realize the effective way of scientific luminous efficiency.
And LED luminous efficiency through direct reduction ascension will bring a decline in the cost of LED particles. At present, most of the white light LED lighting applications are sixty mw the following straight cutting small tube, because this kind of packaging process will bring serious heat dissipation problem, so only suitable for light applications. Now 3528 SMT packaging occupies a major position LED fluorescent tubes, but it's more than 70% of the costs are used for aluminum radiator shell cost and processing, make SMT packaging of high cost in the LED lighting lamps and lanterns of popularization.
At present, the LED Aluminum Profile the whole cost of lamps and lanterns around 15%, but now can really than traditional light source energy saving LED chip but can be counted on one's fingers. And thermal design, constant current power supply design, overall control technology, also is the LED lighting lamps and lanterns have gained popularity before application must solve the technical problems. At present, the heat dissipation and reliability are LED lighting lamps and lanterns product life cycle factors, a thermal design is to LED chip and cooling device path to short, 2 it is to have enough cooling path to reduce heat resistance.
At present, the LED packaging costs accounted for 50%, to reduce the overall cost LED, we must choose a more suitable packaging structure, so change the existing packaging structure, realize reasonable packaging costs, will be LED lighting is the market to accept the most effective and most direct route. Of course, the LED chip with technology, shipments increase, the larger size wafer production process, is also in constant cost reduction, in recent years by 20% a year in lower speed, if can make the packaging cost from to 50% of the total cost reduced to 20% ~ 30%, the LED lighting lamps and lanterns at the application to a new order of magnitude market scale.
Distributed constant current technology, to constantly optimize the "LED constant current drive source" overall solutions, sustainable ascension LED efficiency. At the same time, the miniaturization of switch power supply, continuously optimize thermal design, as well as improve the LED module sealing increase the cooling capacity. All this is Aluminium LED Profile and lanterns market growth up the necessary technical conditions.
]]> https://ameblo.jp/carlanaha/entry-11426296279.html Thu, 13 Dec 2012 17:31:21 +0900

LED Aluminium Profile characteristics, structure and function

Led the heat dissipation problem is led manufacturers the most headache problem, but can use aluminum plate, because of the thermal conductivity of the aluminum, high heat dissipation good, can effective internal heat will be derived. Aluminum plate is a unique metal base copper clad, good thermal conductivity, electrical insulation performance and machining performance. When the design will keep PCB near the aluminum base, so as to reduce the pouring sealant part caused by the thermal resistance.
A, the characteristics of the aluminum plate

1. The surface mounts technology (SMT);

2. In the circuit design of thermal diffusion is very effective treatment;

3. Lower product operating temperature, improve product power density and reliability and prolong the service life of the product;

4. Reduce product volume, reduces the hardware cost and assembly,;

5. Replace brittle ceramic substrates, and gain better mechanical endurance.

Second, Aluminum LED Profile structure

Aluminum copper clad is a kind of metal circuit board material, the copper foil, thermal insulation layer and metal substrate composition, its structure is divided into three layers:

Circuit. Layer line Layer: equivalent to ordinary PCB, the line of copper clad copper foil thickness oz to 10 oz.

DiELcctricLayer insulating layer: insulation layer is a layer of low thermal resistance thermal insulation material.

Basketry base: is the metal base plate, general is aluminum or copper can be chosen. Aluminum copper clad and traditional epoxy glass cloth laminated sheet, etc.
Circuit layer (i.e. copper foil) usually after etching formation printed circuit, make the element of each parts mutual connection, in the ordinary circumstances, circuit layer are required to have a lot of current carrying ability, thus should use thicker copper foil, thickness generally 35 μ m ~ 280 μ m, Thermal insulation layer is aluminum plate where the core technology, it is often filled by special ceramics special polymer structure, thermal resistance is small, the viscoelastic can good, has the thermal aging ability, able to withstand mechanical and thermal stress.
High performance aluminum plate thermal insulation layer is the use of this technology, make its have very good thermal conductivity and high strength of electrical insulation performance; The metal base is aluminum plate support member, the requirement with high thermal conductivity, general is aluminum plate, also can use copper plate (including copper plate can provide better thermal conductivity), suitable for drilling, punching shear and cutting and conventional mechanical processing. PCB material than other materials has incomparable advantages. Suitable for power device SMT public art. No radiator, the volume is greatly reduced, heat dissipation effect very good, good insulation properties and mechanical properties.

Three, LED Profile USES:

Purpose: Power Hybrid IC (HIC).

1. Audio equipment: input, output amplifier, balanced amplifier, audio amplifier, preamplifier, power amplifier, etc.

2. Power supply equipment: switch regulator ` DC/AC converter ` SW regulator, etc.

3. Communication electronic equipment: high frequency amplifier ` filtering electrical ` telegraph circuit.

4. Office automation equipment, motor drive, etc.

5. Car: electronic regulator ` igniter ` power controller, etc.

6. Computer: CPU Board ` floppy disk drive ` power supply equipment, etc.

7. Power module: Inverter ` solid relay ` rectifier bridge, etc.

]]> https://ameblo.jp/carlanaha/entry-11425618030.html Wed, 12 Dec 2012 17:23:56 +0900
In the actual application, high power LED problems mainly displays in the following aspects:

1. To ensure working conditions and LED to supply technical cognitive degree is insufficient. Cause products in the power supply fault emerge in endlessly.
2. To the LED street lamp practical road application concept, is not clear, blind and high power gas discharge lamp "rival" regardless of the cost of making large power LED street lamp, cause no practical price expensive street lamp products to promote.
3. The road lighting requirements feeling of inadequacy, scientific point light source optical light distribution of difficulty and color temperature in road lighting of the importance of oversight, easy cause glare, the effect and the air pollution is serious, the rain fog weather environment, resulting in the phenomenon of bright light ground is not enough.
4. Road lighting requirements fuzzy, the actual operation and maintenance of thoughtlessness, cause the direct use of the owner of the boycott.
5. LED light source due to the requirement of working condition is not known to cause light attenuation serious even die lamp.
LED light source to the working environment of the problem discussion, need to have to understand the basic knowledge of LED, light emitting diode its core is a p-n junction. So it has a general p-n junction I - N characteristics, namely, a positive guide pass, reverse cut-off, breakdown characteristic. In addition, under certain conditions, it also has luminescence properties. In the forward voltage, electronic by N area injection P area, hole by P area injection N area. In the other area of minority carrier (ShaoZi) part and majority carrier (many) composite and shine, and the current high power LED luminous efficiency is about 30%, 70% will be heat energy, needs to be heat treatment. High power white LED junction temperature TJ in intensity attenuation relationship with 70% life can be seen: TJ = fifty, life for 90000 hours, TJ = 80, life to 34000 hours, TJ = 115, its life is only 13300 hours. TJ in thermal design should put forward in the maximum allowable junction temperature value TJmax. Actual junction temperature value TJ should be less than or equal to the requirements of the TJmax, namely TJ acuities TJmax.

For heat dissipation material thermal equilibrium speed requirements importance, causing light source of heat cannot get effective treatment cause serious light attenuation. Now many manufacturers of high power LED Profile application basic use different alloy aluminum material, the coefficient of thermal conductivity is different, some material is difficult to meet the cooling rate LED working conditions. Do not ignore aluminum plate and thermal silicone, silicone grease material thermal link, use material of actual life quality, will directly affect the work of LED cooling conditions. How to reduce the intermediate links, and the direct and heat sink cooling close contact will heat balance fast effective cooling, is now high quality LED lamps and lanterns should be considered in the product development direction.
The first material analysis:
Metal heat conduction coefficient table - 429 silver copper gold 401 317 237 80 67 aluminum iron tin lead 34.8 silver heat conduction coefficient is better, but the shortcoming is that the price is too high, pure copper cooling effect is second, but has a very good the. But copper also has disadvantages: high cost, weight weight, corrosion resistance, etc. So now, most of the fin are using light solid aluminum made of materials, including aluminum alloy heat conduction ability best, good air cooling radiator generally USES aluminium alloy production. As for copper, at present the market also appeared pure copper radiator, the thermal conductivity of copper than aluminum to fast, but copper cooling without aluminum fast, copper can quickly take the heat, but not in the short time to itself, and the quantity of heat of dispersed copper can oxidizing is copper itself the biggest disease. When copper ones appear in oxidation state, from the heat conduction and heat dissipation will drop greatly.
In contrast, the best cooling material also is not aluminum. The contrast of copper and aluminum formed a kind of new technology - copper aluminum combination. The so-called copper aluminum combined with copper and aluminum is to use a certain technology perfect union to a piece of, let copper fast heat to aluminum, again by the large aluminum heat dispersed, which not only increase the thermal conductivity of the aluminum charge less than copper, but also to make up for the copper cooling as aluminum, organic combination so as to achieve rapid heat transfer rapid heat dissipation effect.
Many articles are paper LED Aluminium Profile is to rely on area and not see the size of the volume, a lot of enterprises are to understand the reason, shell using * * finned heat, but the heat sink cooling shell of fin ignore the dust and dust, accumulate over a long period will influence the shell to come loose hot effect. In natural conditions should avoid dust minimization, different direction of wind and rain erosion can be easily natural sex and remove dust sticky apply sex. Ensure that the shell heat sink cooling effect from the affection of the severe environment, cooling channel is smooth, do really long life.
On the increase Aluminum LED Profile guarantee cooling effect, on the basis of the different direction to solve the wind and rain can be natural scour easily sex and remove dust sticky apply sex to ensure that the heat sink of shell heat effect from the affection of severe environment.
With the current metal processing technology to see, mechanical processing is not likely to make rational absolutely flat surface, even if it is lens, also have a lot of small pit, just the naked eye is not too easy to find, in addition to existing on the surface of the pit, there will be a lot of small impurities, such as dust or something. When the radiator surface and chip surface contact, there's a lot of ravine or void of the air. Air Heat conduction ability is very poor. So have to use other material to reduce the thermal resistance, or the performance of the radiator will sell at a discount greatly, can't even play a role.
As a solution, heat conduction medium is made, and its role is to fill two contact surfaces between large and small space, increase the heat sources and heat radiator contact area. Thermal silicone grease is our most common heat conduction medium.
]]> https://ameblo.jp/carlanaha/entry-11424905471.html Tue, 11 Dec 2012 16:11:24 +0900


With the change of micro mixer mixing effect and high efficiency of LED change technology development, plus blue LED luminous efficiency greatly improved, and LED manufacturing cost continued to slide, let LED application scope, and intend to use LED industry range constantly amplification, including LCD, home appliances, automobile and other industry, also began to actively considering the possibility of application of LED, such as consumer products companies for high power LED, can achieve is to save electricity, degree of micro mixer mixing effect, long service life, high color reproducibility, it represents a high heat resistance ability, is LED Profile integrality conditions.
In addition, the liquid crystal panel enterprise faced with European Union RoHS standard, need to face the cold cathode tube comprehensive no mercury change environmental pressure, resulting in the market for high power LED needs more urgent.

LED packaging in addition to protect the internal LED chip outside, still holds concurrently LED chip and external for electrical connection, the function such as heat.

Epoxy resin characteristic is not in high power LED demand

One LED can reach hundreds of Lumen, this is not a big problem, the main problem is that how to deal with heat? Next on the produce so much lumen, how to maintain the stability of the brightness and persistent, this is another important topic, signing Jo processing not properly, the LED brightness and life will drop quickly, for LED, it how to do effective reliability and heat conduction, it is very important.

In the past LED is using low heat conduction rate resin for packaging, but this is regarded as one of the reasons for the cooling characteristics influence, in addition, epoxy resin heat resistance is poor, may appear, in the life of the LED chip itself not to reach the front, epoxy resin is already present color, therefore, increase the cooling property is key.

In addition, not only because hot phenomenon of epoxy resin changes, even short wavelength for epoxy resin cause problems, this is because the white light LED luminous spectrum, also contain short wavelength light, and epoxy resin is quite easy to white LED by the short wavelength light damage, even if is the low power white LED, already can make epoxy resin failure phenomenon aggravate, besides high power white LED a short wavelength light more, deteriorating nature than low power design more quickly, and even some products in the continuous light after the service life of only 5000 hours, even more short! So, instead of constantly overcome for the old packaging material epoxy resin brought with color, as in seeking a new generation of packaging material efforts.

Metal base plate into the new focus

So in recent years gradually convert high heat conduction ceramic, or metal resin encapsulation structure, which is in order to solve the heat dissipation, and strengthen the original features do efforts. High power LED chip change commonly used way is: chip large-scale, improve the luminous efficiency, high take efficiency of light encapsulation, and large current change. This kind of practice although current luminous quantity will increase in proportion, but the calorific value will rise with it.

For high power LED packaging technically, due to the heat dissipation problem has caused a certain degree of distress, in this context with high cost efficiency LED Aluminum Profile technology, became LED high efficiency change after the other one is the new development of concern.

The past LED output power is small, so use traditional FR4 and glass epoxy resin encapsulation base plate, will not cause too much heat, but used in the high power LED lighting, the luminous efficiency is about 20% ~ 30%, although the chip area is quite small, the overall power consumption is not high also, but the calorific value per unit area is large.

Generally speaking, the resin base plate heat dissipation, can only support under 0.5 W LED, more than 0.5 W above, LED to metal or ceramic high heat dissipation base plate for packaging, the main reason is that the base plate heat resistance directly affect LED life and performance, therefore packaging base plate become design of micro mixer mixing effect LED the development of the goods on.

High power accelerate metal base plate instead of resin material

About Aluminium LED Profile design, at present can be roughly divided into, the LED chip to package body heat conduction, and assembly body to external thermal convey in two parts. Use high heat conduction materials, packaging internal temperature will become smaller, the heat is not local concentration, the LED chip whole produce heat flow, the radial flow to every corner in the sealed, so use high heat conduction materials, can improve the internal thermal diffusivity.

Is the improvement of the heat transfer, it is almost entirely on materials improve to solve the problem? Most people think, with LED chip large-scale, high current is changed, high power change, will accelerate the development of metal packaging instead of traditional resin encapsulation.

The metal substrate materials in high heat, can be divided into hard and deflection two base plate, structure, hard base plate belongs to traditional metal materials, metal LED packaging base plate adopt aluminum and copper materials, insulation parts, most of the mining filling heat conductivity inorganic filler, with high heat conductivity, processability, electromagnetic shielding property, heat resistant to impact and metal properties and thickness are greater than 1 mm, mostly are widely used in LED lamps and lanterns module, and lighting module, etc., it is technically and aluminum base plate with the same high heat conduction ability, in the high cooling requirements, quite have the ability to fill high power LED packaging material.

Actively develop deflection base plate

But the emergence of the base plate bending, the original expected application in automobile navigation LCD backlight module thin shape change needs and development, as well as the high power LED can complete stereoscopic packaging requirements, basically can be produced under bending base plate with aluminum for materials, the application of aluminium heat conductivity and lightweight characteristic, make high density packaging base board, through the aluminum base plate sheet change, darker deflection characteristics, and also can have high heat conduction characteristics

Generally speaking, metal packaging base plate heat transfer rate is about 2 w/mK, but due to the high efficiency LED the heating effect of the higher, so in order to meet to 4 ~ 6 w/mK the needs of the thermal conductivity, the thermal conductivity has been more than eight w/mK metal packaging base plate. Because of hard metal packaging base plate main purpose is to be able to meet the high power LED encapsulation, so the package base plate industry is actively developing can improve the rate of heat transfer technology. Although the use of aluminum plate quality reinforcing plate can improve the heat resistance, but cost and assembly limit, cannot fundamentally solve the problem.

However, metal packaging base plate defect is, metal thermal expansion coefficient is very big, when with low thermal expansion coefficient ceramic chip welding, easy to heat cycle impact, so when using aluminum nitride packaging, metal packaging substrates may occur not harmonious phenomenon, so must overcome LED, different coefficient of thermal expansion materials, caused by thermal stress difference, improve the reliability of the base board packaging.
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At present, the LED application of heat dissipation problem is LED manufacturers the most headache problem. Cooling base plate is a provide heat conduction medium. LED to cool base plate - cooling module, it can increase the LED the bottom area, increase the cooling area, mainly by the copper foil circuit/ceramic powder + polymer/aluminum board composition. Cooling base plate in the LED industry applications with high thermal conductivity, safety and environmental protection function, etc. Introduced the aluminum material base plate, because of the thermal conductivity of the aluminum, high heat dissipation good, can effective internal heat will be derived. Aluminum plate is a unique metal base copper clad, good thermal conductivity, electrical insulation performance and machining performance. When the design will keep PCB near the aluminum base, so as to reduce the pouring sealant part caused by the thermal resistance.
A, Aluminium LED Profile characteristics
1. The surface mounts technology (SMT);
2. In the circuit design of thermal diffusion is very effective treatment;
3. Lower product operating temperature, improve product power density and reliability and prolong the service life of the product;
4. Reduce product volume, reduces the hardware cost and assembly,;
5. Replace brittle ceramic substrates, and gain better mechanical endurance.
Second, LED Aluminium Profile structure
Aluminum copper clad is a kind of metal circuit board material, the copper foil, thermal insulation layer and metal substrate composition, its structure is divided into three layers:
Circuit. Layer line Layer: equivalent to ordinary PCB, the line of copper clad copper foil thickness oz to 10 oz.
DielcctricLayer insulating layer: insulation layer is a layer of low thermal resistance thermal insulation material.
Basketry base: is the metal base plate, general is aluminum or copper can be chosen. Aluminum copper clad and traditional epoxy glass cloth laminated sheet, etc.
Circuit layer (i.e. copper foil) usually after etching formation printed circuit, make the element of each parts mutual connection, in the ordinary circumstances, circuit layer are required to have a lot of current carrying ability, thus should use thicker copper foil, thickness generally 35 μ m ~ 280 μ m, Thermal insulation layer is aluminum plate where the core technology, it is often filled by special ceramics special polymer structure, thermal resistance is small, the viscoelastic can good, has the thermal aging ability, able to withstand mechanical and thermal stress.
Aluminum LED Profile plate thermal insulation layer is the use of this technology, make its have very good thermal conductivity and high strength of electrical insulation performance; The metal base is aluminum plate support member, the requirement with high thermal conductivity, general is aluminum plate, also can use copper plate (including copper plate can provide better thermal conductivity), suitable for drilling, punching shear and cutting and conventional mechanical processing. PCB material than other materials has incomparable advantages. Suitable for power device SMT public art. No radiator, the volume is greatly reduced, heat dissipation effect very good, good insulation properties and mechanical properties.
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In the past about 150 years, lighting industry has developed into a based on the standard bulb mass production industry. Lamp design has intrinsic outdated sex. Consumers often find themselves with the same new products to replace the short life in products. This trend, combined with a small part of the large manufacturers is inseparable. They thought the low cost manufacturing hundreds of millions of the same kind of products to meet the needs of the market.
As for the LED Aluminium Profile industry technical transformation, this kind of business model is still can continue to maintain its biggest interest? And whether it can make use of solid state lighting basic advantage?
Obviously, LED in energy efficiency and working life has very significant advantages. LED bulb needs only a third of the power consumption, and can provide with the traditional incandescent lamp and the fluorescent lamp is almost the same amount of light. And based on the more mature than technology products. LED bulb life also is expected to more than twenty times higher. Moreover, the LED light bulb solid element is relatively weak tradition lighting technology character, can provide better mechanical damage protection. In short, these characteristics can be LED lighting products to provide users with an attractive return on investment (ROI), especially for maintenance and replacement bulb is difficult and/or expensive commercial and industrial application.
The technology may be longer working life is equally important. Higher efficiency and more solid design are LED is the structure flexibility. For example, lighting designer can choose to use Aluminum LED Profile, make its focus on a particular shape distribution, not the light source concentrates in together, using diffuse apparatus and mask the distribution to where it is needed. These characteristics can give lighting designers infinite design freedom, innovation way design light source. Product development staff will be LED lighting products production into any shape, or lighting lamps and lanterns embedded building materials, walls or furniture inside. They can be more accurate directional light, or more easy to control its strength or color, so as to build a dynamic lighting environment. Some manufacturers have developed the prototype, they in the daytime are transparent, through the clever use of LED and different refractive index materials, they will shine in the night.
Lighting electric appliance
By the use of LED longer working life advantage and can form various shapes and size of the technology innovation, designers can use lighting industry from mass production to mass customization business transformation. This new industry is not based on standardized, the need for frequent replacement bulbs and lamps and lanterns basis, it will be for product development staff offer a wide range of reference design option, this kind of design often use LED technology one or more specific properties. With the aid of intelligent automatic design tools, manufacturers will be able to quickly develop highly customized lighting solutions to meet each customer's individual needs. In this kind of lighting is not disposable supplies, but the sustainable use of ten years of new business model, the aesthetic feeling of the light source can be embedded in the commercial or industrial building walls, or embedded in residential furniture, and they will serve as electrical appliances for sale, can be in building or residence decorate the transformation of the former has been used.
To achieve this goal, the designer must take the system design method. The first generation of LED lighting system in premature failure has proved that any LED Profile life of the product depends on the working life of the shortest single element. Although usually LED circuit can meet energy star SSL V 1.1 L70 by about 45000 hours of working life requirements, but for the circuit power supply of ordinary two stage power makes life cycle is only for 20000 hours. In fact, the power supply design of the weak link failure LED technology of long service life and high ROI advantage.
Eliminate the fault point
Why did I do this? Now many LED lighting system is using typical two levels of power. The power supply will be used to improve the power factor of the primary booster converter and secondary high voltage DC - DC converter unifies together. The power is the most common fault point is used in two stages between large capacity storage of electrolytic capacitor. Due to the need to be in full load under continuous work, and are usually placed in ballast a molding shell or lamp base and airtight narrow space inside, plus the high calorific value of power supply and high brightness LED, these large capacity electrolytic capacitor must withstand harsh high temperature conditions. But in fact, the capacitor dielectric material performance will gradually decrease. The device will lose capacitance and lead to failure. Although LED lighting scheme of the controller and other semiconductor life can reach 100000 hours, diodes, transistors and ceramic capacitor also has the same long service life, but at present most of lighting industry two level power supply the electrolytic capacitor life are only 20000 hours.
In view of LED technology, there is an obvious weakness. Thermal management is very important: the use of the traditional technology and light bulb can infrared from dissipation too much energy, but must be LED to too much heat transfer to their fin. The heat is easy to achieve a high level, especially in the lighting scheme has been compressed into a smaller bulb when base. For these ReWenTi to elaborate management in LED design is especially important, because the higher the temperature of the environment will not only improve the LED junction temperature, thus affecting the light output, but also can shorten the working life of the LED.
To solve this problem a method is, in the development of LED lighting solutions using such power topology structure: can also eliminate segregation flyback type design fragile electrolytic capacitor and unreliable optical isolator. A new generation of single power LED driver can through the elimination of these potential fault point to meet this need. The electrolytic capacitor replaces with high stability of the ceramic capacitor. The service life of the power supply can be very close to the LED. In addition, through the in more than 90% of the work frequency, at the same time beyond energy star of PF and THD request, these highly integrated converter can produce less heat, and in this process helps to simplify the highly compact lighting design of thermal management issues.
Conclusion
Obviously, LED technology in flexibility, efficiency and service life has unique design advantages, at the same time for lighting manufacturers offers completely change the industry model of good opportunities. However, in order to make these advantages to maximize, designers must will lead and its power as a single electric research and design. Through careful consideration various design elements on the influence of heat distribution and how to better control the environmental condition, lighting developers can the industry transition to a new stage, let LED solutions become building and residential building real organic part.
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